Design of elastic and dissipation joints in bearing structures of electronic packages

Mathematical modeling and experimental research represented in this paper is aimed at dynamic force analysis of circuit cards order to eliminate or reduce stress deflection an acceptable level provide strength reliability design card assemblies subjected vibration. In conditions when viscous friction forces are negligible dampers, such as liquid cannot be used reduction oscillation amplitude critical frequencies was proposed by creating dry damper. On the base mathematical model, method for reducing section resonance has been developed inserting additional elastic dissipation joint introduced The damper device three variants design. effectiveness characterized its damping characteristics especially stiffness.